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Advances in CMP/polishing technologies for the manufacture of electronic devices
Title statement Advances in CMP/polishing technologies for the manufacture of electronic devices / edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa Cover Title Advances in CMP polishing technologies Edition statement 1st ed. Issue data Oxford : William Andrew, 2012 Phys.des. xii, 317 s. : il., grafy ISBN 978-1-4377-7859-5 (váz.) Internal Bibliographies/Indexes Note Obsahuje bibliografie a rejstřík Another responsib. Doi, Toshiro K., 1947- (editor)
Marinescu, Ioan D. (editor)
Kurokawa, Syuhei (editor)Subj. Headings broušení * fyzika povrchů pevných látek * elektronika * čisticí technika Form, Genre monografie Conspect 621.38 - Elektronika UDC 621.923 * 539.211 * 621.38 * 648.5.06 * (048.8) Country Velká Británie Language angličtina Document kind Books 
Call number Barcode Sublocation Volný výběr Info KB 30242 3300049222 volný výběr D450 2012 Date due 31 days
Number of the records: 1